Practical, reusable guidance for preparing RFQs, checking manufacturability and qualifying a PCB supply route. The data, stackup and fabrication decisions that prevent avoidable delays.
Define the electrical intent
Start with the interfaces that drive risk: impedance, current, RF loss, thermal path, via structure and mechanical envelope. These constraints should shape the stackup before routing is considered complete.
Lock the manufacturing variables
Material family, finished copper, dielectric thickness, via type and surface finish interact. Treat them as one manufacturing system and review substitutions before a purchase order is released.
A transparent capability framework for multilayer, HDI, high-speed, RF and rigid-flex builds.
Design verification into the build
Specify coupons, test coverage, acceptance criteria and reports at quotation. Evidence is most economical when it is planned with the panel and process, not requested after fabrication.
What to send your fabricator
Provide Gerber or ODB++, fabrication drawing, approved stackup, drill data, netlist, IPC class, tolerances and controlled notes. For assembly, add BOM, pick-and-place and test requirements.