Engineering review
Our own factories manufacture prototypes and low-to-medium volume PCB orders, with our engineering and quality teams responsible for material review, inspection and repeat-order consistency.
Custom PCB manufacturing
Substrate-Like PCB (SLP)
Fine-line, any-layer interconnect technology for compact high-density modules, subject to engineering review. Our own factories manufacture prototypes and low-to-medium volume PCB orders, with our engineering and quality teams responsible for material review, inspection and repeat-order consistency.
Get a factory-direct quoteJETFGO / Substrate-Like PCB (SLP)
PRODUCT & PROCESS DETAIL
PRODUCT & PROCESS DETAILRepresentative capability
Confirm manufacturing fit before you quote your customer.
Buy directly from the manufacturer. Our own factory teams review DFM, plan production and inspect your boards, with equipment and process records available for supplier qualification.
BuildUp to 16-layer any-layer
Laser viaFrom 50 μm
Fine line / spaceFrom 30 / 30 μm
ProcessesSubtractive · mSAP · amSAP
Why channel and sourcing teams work with JETFGO
Why channel and sourcing teams work with JETFGO
Buy directly from the manufacturer. Our own factory teams review DFM, plan production and inspect your boards, with equipment and process records available for supplier qualification.
Material & stackup
A transparent capability framework for multilayer, HDI, high-speed, RF and rigid-flex builds.
Precision fabrication
Fine-line, any-layer interconnect technology for compact high-density modules, subject to engineering review.
Inspection & delivery
Use published process limits, equipment and inspection controls to qualify the order, explain constraints and prepare a more complete customer quotation.
Typical applications
Translate end-use risk into a manufacturable supply requirement.
Fine-line, any-layer interconnect technology for compact high-density modules, subject to engineering review.
FAQ / Manufacturing intelligence
Engineering questions
Fine-line, any-layer interconnect technology for compact high-density modules, subject to engineering review.
03Engineering questions
01What should I send for a Substrate-Like PCB (SLP) quotation?+
Gerber or ODB++, fabrication drawing, stackup, quantity, material, surface finish and controlled requirements. Add the BOM and pick-and-place files for PCBA.
02Can JETFGO support both prototypes and production?+
Yes. The factory is organized for quick prototypes and scalable low-to-medium volume production, keeping the engineering record connected between builds.
03How is quality verified?+
The control plan may include incoming material checks, AOI, electrical test, impedance verification, dimensional inspection and final QA according to the build.
RFQ / DFM
Discuss your next order directly with our factory.
Send the Gerber or ODB++, stackup, material, quantity, target date and test requirements. Our team will review feasibility and return a technical quotation for the order you manage.
Engineering reviewMaterial & stackupPrecision fabrication