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PCB manufacturing capabilities

A transparent capability framework for multilayer, HDI, high-speed, RF and rigid-flex builds.

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JETFGO / PCB manufacturing capabilitiesPCB manufacturing capabilitiesPRODUCT & PROCESS DETAIL
TECHNICAL WINDOW

Confirm manufacturing fit before you quote your customer.

Use published process limits, equipment and inspection controls to qualify the order, explain constraints and prepare a more complete customer quotation.

Rigid layersUp to 60 layers
Flex layersUp to 12 layers
Rigid board thickness0.3–8.0 mm
Flex board thickness0.1–1.0 mm
Rigid copper thickness1/3–28 oz
Flex copper thickness1/3–2 oz
Minimum line / spacing3 / 2.5 mil
Impedance tolerance±8%
Minimum finished board10 × 10 mm
BGA pitch0.4 mm
Laser drill3–5 mil
Mechanical drill aspect ratioUp to 20:1 rigid
Laser drill aspect ratioUp to 4:1 rigid
Fixture test sizeUp to 1150 × 650 mm
IPC classClass 2 and Class 3
Surface finishesHASL, LF HASL, OSP, ENIG, ENEPIG, immersion silver/tin, hard gold
EXTENDED PORTFOLIO

Confirm manufacturing fit before you quote your customer.

A transparent capability framework for multilayer, HDI, high-speed, RF and rigid-flex builds.

ABF IC Substrate
12

ABF IC Substrate

Ultra-fine ABF package substrate capability for advanced semiconductor interconnects, subject to engineering review.

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PCB PROCESS CAPABILITY

Confirm your design requirements with confidence

Review rigid and flexible PCB materials, dimensions, tolerances and special processes to confirm the right manufacturing path for your project.

#Capability itemRigid PCBFlex PCBEngineering notes
01Board MaterialTG135, TG150, TG170, TG180 FR4: SHENGYI, ITEQ, KB, EMC Rogers: RO4003C, RO4350 Metal Core: BOYU Halogen-free: S1150G, S1170G, KB-6167G, KB-6165GSHENGYI, Pyralux® KP, Panasonic Polyimide: SF305C, SF30, SF202, SF201, R-F775Please specify material types and construction details.
02LayersMaximum 60 layersMaximum 12 layersPlease specify minimum and maximum layer count.
03Board Thickness0.3–8.0 mm0.1–1.0 mm—
04Thickness Tolerance0.08–10%8–10%—
05Copper Thickness — Inner1/3–28 oz1/3–2 ozSpecify required finished copper weight.
06Copper Thickness — Outer1/3–28 oz1/3–2 ozSpecify required finished copper weight.
07Surface TreatmentHASL, lead-free HASL, OSP, gold plating, ENIG, immersion silver, immersion tin, gold finger, ENEPIGENIG: 1–4 μinENIG: 1–4 μin Gold finger: 4–70 μin Please specify soft/hard bondable gold thickness.
08Solder MaskGlossy: green, white, black, blue, red, yellow, purple, grey Matte: green, white, black, blue, red, yellow, purple, greyGreen or yellow coverlay / solder maskSpecify color and glossy or matte finish.
09Minimum Dimensions10 × 10 mm10 × 10 mmSpecify dimensions and routing method.
10Resin Plug Hole — Finished≤ 0.5 mm—Specify dimensions and routing method.
11Castellated Holes±0.1 mm±0.1 mmSpecify clearance and routing method.
12Inner Line Width / SpacingMinimum 3 / 2.5 milMinimum 3 / 2.5 mil12 μm: 3 / 2.5 mil 17.5 μm: 3 / 4 mil 35 μm (1 oz): 4 / 4 mil 70 μm (2 oz): 8 / 8 mil 105 μm (3 oz): 10 / 10 mil 140 μm (4 oz): 12 / 12 mil 175 μm (5 oz): 14 / 14 mil 210 μm (6 oz): 16 / 16 mil 245 μm (7 oz): 20 / 20 mil 280 μm (8 oz): 24 / 24 mil 315 μm (9 oz): 28 / 28 mil 350 μm (10 oz): 30 / 30 mil
13Outer Line Width / SpacingMinimum 3 / 2.5 mil (1 oz)Minimum 3 / 2.5 mil (1 oz)—
14Line Width Tolerance10–20%10–20%—
15Impedance Value & Tolerance±8%±8%—
16Group Impedance±8%±8%—
17Solder Mask BridgeGlossy: minimum 4 mil Matte: minimum 6 mil——
18Silkscreen Height / Width5:1 ratio5:1 ratio—
19External Dimension Tolerance±4 mil——
20V-Cut Board Thickness0.3–3.0 mm——
21V-Cut Angle20°, 30°, 45°, 60°——
22V-Cut Angle Tolerance±5°——
23Board RoutingRouting, punching, V-cut, bevelingPunching, laser—
24Edge Plating Thickness70 μm35 μm—
25Test Point to Plate EdgeMinimum 0.2 mmMinimum 0.2 mm—
26Fixture Test Maximum Size1150 × 650 mm1150 × 650 mm—
27Peelable Solder Mask ThicknessFirst coating: 0.15–0.2 mm Second coating: 0.2–0.4 mm——
28IPC StandardClass 2 and Class 3Class 2 and Class 3—
29Kapton Tape0.1 mm0.1 mm—
30BGA Pitch0.4 mm0.4 mm—
31Blind Via3–5 mil3–5 mil—
32Buried ViaStacked: 5+N+5 StaggeredStacked: 2+N+2 Staggered—
33Laser Drill Size3–5 mil3–5 mil—
34Aspect RatioLaser: 4:1 Mechanical: 20:1Laser: 3:1 Mechanical: 8:1—
35Back DrillingAny-layerAny-layer—
36Carbon Ink10 mil8 mil—
Capability specificationPCB Process Capability Chart
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From data package to shipment

From data package to shipment

01

Engineering review

Buy directly from the manufacturer. Our own factory teams review DFM, plan production and inspect your boards, with equipment and process records available for supplier qualification.

02

Material & stackup

Buy directly from the manufacturer. Our own factory teams review DFM, plan production and inspect your boards, with equipment and process records available for supplier qualification.

03

Precision fabrication

Buy directly from the manufacturer. Our own factory teams review DFM, plan production and inspect your boards, with equipment and process records available for supplier qualification.

04

Inspection & delivery

Buy directly from the manufacturer. Our own factory teams review DFM, plan production and inspect your boards, with equipment and process records available for supplier qualification.

RFQ / DFM

Discuss your next order directly with our factory.

Send the Gerber or ODB++, stackup, material, quantity, target date and test requirements. Our team will review feasibility and return a technical quotation for the order you manage.

Engineering reviewMaterial & stackupPrecision fabrication
Contactsal@jetfgo.comOpen RFQ checklist