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Thermoelectric Separation Board

Layers: 2

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JETFGO / Thermoelectric Separation Board

PRODUCT & PROCESS DETAIL

PRODUCT / PROCESS DATA

Layers2

MaterialFR-4+Copper Base

Surface FinishENIG

Board Thickness3.8mm

Minimum Hole0.4mm

Line Width & Space6 / 6mil

Special TechnologyThermoelectric Separation

层数：2

板材：FR4+紫铜

表面处理：沉金

板厚：3.8MM

最小孔：0.4MM

线宽线距：6/6mil

工艺：多层热电分离

E-mail： sal@jetfgo.com

Tel： 0755-23300780 / 23302390

Fax： 0755-23302910

Add： Building 18, District 1, Xinhe Xinxing Industrial Park, Fuhai Street, Baoan District, Shenzhen

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Thermoelectric Separation Board

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Send the Gerber or ODB++, stackup, material, quantity, target date and test requirements. Our team will review feasibility and return a technical quotation for the order you manage.

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