Products & applications

Thermoelectric Separation Board

Layers: 2

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JETFGO / Thermoelectric Separation Board

PRODUCT & PROCESS DETAIL

PRODUCT / PROCESS DATA

Layers2

MaterialCopper base+ST115B

Surface FinishENIG

Board Thickness3.2mm

Minimum Hole1.6mm

Line Width & Space8 / 8mil

Special TechnologyMetal Base, Thermoelectric Separation

E-mail： sal@jetfgo.com

Tel： 0755-23300780 / 23302390

Fax： 0755-23302910

Add： Building 18, District 1, Xinhe Xinxing Industrial Park, Fuhai Street, Baoan District, Shenzhen

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Thermoelectric Separation Board

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Send the Gerber or ODB++, stackup, material, quantity, target date and test requirements. Our team will review feasibility and return a technical quotation for the order you manage.

Engineering reviewMaterial & stackupPrecision fabrication

Contactsal@jetfgo.com Open RFQ checklist